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IEEE 1156.2

1996 Edition, June 20, 1996

Complete Document

Environmental Specifications for Computer Systems

Includes all amendments and changes through Stabilization Notice (No longer revised / updated) , March 19, 2009


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Description / Abstract:

This standard is designed for use in conjunction with other standards such as the IEEE 1101 group of standards (Mechanical Specification for Microconnectors and Eurocard Form Factors), the IEEE 896 group of standards (Futurebus+®), the IEEE 1596 group of standards (Scalable Coherent Interface), the IEEE 1014 group of standards (VMEBus), and ISO/IEC 10861: 1994 (MULTIBUS 11).

This standard is one of the IEEE P1156.x series for environmental specifications. It is intended to be used as a core specification. It contains minimum environmental withstand conditions applicable to computer systems and all of their associated components. It has been created to provide general environmental withstand conditions for one or more of the above listed computer busses or interconnect standards, and electronic equipment in general.

While this standard was specifically created for use with IEEE Computer Society bus standards, nothing herein is intended to restrict its use for other applications, where applicable. A supplier and user may agree to more or less restrictive environmental specifications than those listed below. However, if their specifications are less restrictive than those listed herein, neither supplier nor user may claim conformance to this standard.

Purpose

It is the purpose of this standard to provide a core specification for physical integrity and environmental performance levels for computer systems.

It is the responsibility of the system designer to evaluate the relationship between module- and componentlevel environmental specification and the system-level environmental specification for the enclosure that contains the modules. For example, the modules are conduction or convection cooled and a system-level thermal "model" is required to determine the relationship and compatibility between the module's heat sink and the system-level cooling medium.