IPC-CF-152 Revision B, December 1, 1997
Composite Metallic Material Specification for Printed Wiring Board
Published By:Association Connecting Electronics Industries (IPC)
This specification covers the requirements for copper/invar/copper (CIC), copper/molybdenum/copper (CMC), three-layer composite. The CIC material consists of copper bonded to each side of a layer of invar (nominal 36% nickel and 64% iron alloy). The copper clad molybdenum consists of copper bonded to each side of molybdenum.
This specification addresses the requirements for procurement of copper/invar/copper and copper/molybdenum/copper for use in electronic applications.