IPC-D-326 Revision A, January 1, 2004
Information Requirements for Manufacturing Printed Boards and Other Electronic Assemblies
Published By:Association Connecting Electronics Industries (IPC)
This document covers the information requirements for the procurement of material, box build, assembly, system integration, inspection, test, burn-in, and delivery and/or distribution of electronic assemblies.
The purpose of this document is to outline an effective method of transferring product assembly information intercompany or from OEM to the assembler.
The level of assembly documentation that is required is dependent on both the overall complexity of the product and whether the assembly process must meet government, military or other regulatory agency requirements.