49147

IPC 2225

Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)

standard by Association Connecting Electronics Industries , 05/01/1998

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Full Description

This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.
 

Product Details

Published:
05/01/1998
ANSI:
ANSI Approved
Number of Pages:
44
File Size:
1 file , 590 KB
Product Code(s):
2225(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus