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IPC-2225

1998 Edition, May 1, 1998

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Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies



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Description / Abstract:

This standard establishes requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of organic mounting structure used to interconnect chip components, which in combination form the completed functional Single Chip Module (SCM-L), MCM, or MCM-L assemblies.