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IPC-HM-860

1987 Edition, January 1, 1987

Complete Document

Specification for Multilayer Hybrid Circuits



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Description / Abstract:

This specification covers the qualification and performance requirements of multilayer circuits used in hybrid packaging. These circuits consist of three or more layers of conductor patterns separated from each other by insulating materials and interconnected by a continuous metallic interlayer connection. The substrate structure may- include passive elements.

Purpose. The purpose of this specification is to provide qualification and acceptance requirements for commercial and government procurement of multilayer circuits used in hybrid packaging