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IPC-L-108

Revision B, June 1990

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Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards



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Superseded By: IPC-4101

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Additional Comments:
CNCL S/S BY IPC-4101
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Referenced Items:

IPC-L-109
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Description / Abstract:

This specification covers the requirements for metal clad base material herein referred to as laminate, to be used primarily for multilayer printed boards for electrical and electronic circuits.