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IPC-ML-950

Revision C, November 1, 1986

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Performance Specification for Rigid Multilayer Printed Boards



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Superseded By: IPC-6011

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CNCL S/S BY IPC-6011 & IPC-6012
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Description / Abstract:

This specification covers qualification and performance of rigid multilayer printed boards with platedthrough holes. Circuitry may be bare copper, metallic overplated or coated, unfused, fused, leveled etc.

Purpose. The purpose of this specification is to provide classes of requirements for performance/acceptance of multilayer printed boards for industry and government use, (excluding multilayer flexible and rigid-flex products).