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IPC-SM-780

1988 Edition, July 1, 1988

Base Document Only

Component Packaging and Interconnecting with Emphasis on Surface Mounting



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Referenced Items:

IPC-MC-790

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Description / Abstract:

This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and interconnection substrates necessary for sophisticated electronic assemblies.