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IPC-SM-782

Revision A, 1996

Complete Document

Surface Mount Design and Land Pattern Standard

Includes all amendments and changes through Amendment 2, April 1999


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Superseded By: IPC-7351

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Additional Comments:
CNCL S/S BY IPC-7351
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Referenced Items:

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Description / Abstract:

This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection and testing of those solder joints.