Hello. Sign In
Standards Store

ALERT: Due to a water main break at our production facility, hardcopy orders may be delayed. We expect to be back to normal operation
by May 30. For the inconvenience, we have set up a promotion code for 15% off any hardcopy orders while we complete repairs.
Enter IHSM at checkout to receive your discount. Please contact your local
sales office to discuss other delivery options.
PDF delivery orders will not be impacted.

Look Inside


1986 Edition, April 1, 1986

Complete Document

Results of IPC Copper Foil Ductility Round Robin Study

Detail Summary

Active, Most Current

Additional Comments:
Price (USD)
Add to Cart

Product Details:

Description / Abstract:

Objectives and Scope

The Metalic foil Subcommitee of the Base Material Committee (formerly the Copper Foil Subcommittee of the Raw Materials Committee) decided in August 1982 to undertake a round robin test program on copper foil ductility. The objectives of this Round Robin Study were set by the Subcommittee to be:

(1) the determination of typical ductility values for the various types and classes of copper foil from different foil manufacturers;

(2) the establishment of minimum ductility requirements for the IPC-CF-150, Copper Foil for Printed Wiring Applications1

(3) the round robin testing of the fatigue ductility test method for metallic foils2 to

(a) determine critical and sensitive test method steps,and

(b) if necessary, generate the information to emphasize and elucidate any critical test method steps,

(4) the establishment of the extent to which the relationship underlying the fatigue ductility test method can be utilized to predict the high-cycle fatigue behaviour of metallic foils,and

(5) the determination of the bending fatigue behaviour of the copper foils