IPC-TR-578

1984 Edition, September 1984

Complete Document

Leading Edge Manufacturing Technology Report Results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double Sided Printed Wiring Boards

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Revision: 1984 Edition, September 1984
Published Date: September 1984
Status: Active, Most Current
Document Language: English
Published By: Association Connecting Electronics Industries (IPC)
Page Count: 100
ANSI Approved: No
DoD Adopted: No

Description / Abstract:

OBJECTIVE

The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:

To evaluate the state-of-the-art in the international printed wiring board industry for fabrication of high density, double sided, rigid bare copper boards.
Collect data on different manufacturing methods and substrates used to fabricate printed wiring boards.
Include all recognized printed wiring board manufacturing methods: i.e., subtractive, thin foil, semi-additive and fully-additive.
Determine the reliability and quality of the boards producedu sing recognized industry testing practices and procedures.

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