IPC-TR-5781984 Edition, September 1, 1984Complete DocumentLeading Edge Manufacturing Technology Report Results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double Sided Printed Wiring Boards
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Product Details:
 Description / Abstract:
OBJECTIVE
The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:
 
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