J-STD-013 1996 Edition, July 1, 1996
Implementation of Ball Grid Array and Other High Density Technology
Includes all amendments and changes through Change/Amendment , July 1996
Additional Comments: INCLUDES PHOTOS W/D S/S BY IPC-7095 C/R
Published By:Association Connecting Electronics Industries (IPC)
This document establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/ high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and reliability expectations based on end-use environments.
The focus of the document is on design through testing issues related to Ball Grid Array and other high performance packages including fine pitch, ultra fine pitch and thru-hole PGA.
The purpose of this document is to provide confidence in the Design through Testing processes to ensure that the final assembly will meet the intended goals for product performance. Reliability is established through end use environments that consider the performance requirements of assemblies that are used in electronic products in such markets as consumer, computer, telecommunication, commercial aircraft, industrial & automotive passenger compartment, military ground & ship, space (both LEO and GEO), military avionics, and automotive underhood electronics and the customary use of those equipments.