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J-STD-001

Revision F, July 2014

Complete Document

SPACE APPLICATIONS ELECTRONIC HARDWARE ADDENDUM TO IPC J-STD-001F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

Includes all amendments and changes through Addendum 1, January 2017


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Description / Abstract:

"This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001F with Amendment 1 to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. When required by procurement documentation/drawings, this Addendum supplements or replaces specifically identified requirements of J-STD-001F with Amendment 1.This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001 and IPC-A-610. This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component placement or for applying flux and solder used to make the electrical connection."