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About This Item

 

Full Description

This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solder wave process and/or solder fountain (rework/replacement) process. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
 

Document History

  1. JEDEC JESD22-B106E

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    RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

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  2. JEDEC JESD22-B106D


    RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

    • Historical Version