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JIS Z 3282

2017 Edition, March 21, 2017

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Soft solders - Chemical compositions and forms



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Product Details:

  • Revision: 2017 Edition, March 21, 2017
  • Published Date: March 21, 2017
  • Status: Active, Most Current
  • Document Language: English
  • Published By: Japanese Standards Association (JSA)
  • Page Count: 22
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

This Standard specifies lead-containing soft solders used in the field of general or electric/electronic industries (hereafter referred to as lead-containing solders) and soft solders not containing lead (hereafter referred to as lead-free solders).

NOTE: The International Standards corresponding to this Standard and the symbol of degree of correspondence are as follows.

ISO 9453: 2014 Soft solder alloys-Chemical compositions and forms

lEC 61190-1-3: 2010 Attachment materials for electronic assemblyPart 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (overall evaluation: MOD)

In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/ IEC Guide 21-1.