MIL-A-87135 1979 Edition, February 16, 1979
ADHESIVES, NON-CONDUCTIVE, FOR ELECTRONICS APPLICATION
Includes all amendments and changes through Cancellation Notice 3, March 17, 2010
Additional Comments: CNCL NO S/S
This specification establishes requirements for a moderately fast curing adhesive used for bonding components to printed-wiring assemblies to prevent vibration damage.