MIL-C-47113 Revision B, November 28, 1986
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
Includes all amendments and changes through Reinstatement Notice 4, October 18, 1996
Additional Comments: CNCL S/S BY MIL-DTL-47113
This specification covers a silicone and/or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal (see 6.1).