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MIL-HDBK-419 Revision A, December 29, 1987
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Includes all amendments and changes through Validation Notice 1, February 20, 2014
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This volume is one of a two-volume series which sets forth the grounding, bonding, and shielding theory for communications electronics (C-E) equipments and facilities. Grounding, bonding, and shielding are complex subjects about which in the past there has existed a good deal of misunderstanding. The subjects themselves are interrelated and involve considerations of a wide range of topics from electrochemistry and metallurgy to electromagnetic field theory and atlmspheric physics. These two volumes reduce these varied considerations into a usable set of principles and practices which can be used by all concerned with, and responsible for, the safety and effective operation of complex C-E systems. Where possible, the Principles are reduced to specific steps. Because of the large number of interrelated factors, specific steps cannot be set forth for every possible situation. However, once the requirements and constraints of a given situation are defined, the appropriate steps for solution of the problem can be formulated utilizing the principles set forth.

Both volumes (Volume I, Basic Theory and Volume II, Applications) implement the (Grounding, Bonding, and Shielding requirements of MIL-STD-188-124A which is mandatory for use within the Department of Defense. The purpose of this standard is to ensure the optimum performance of ground-based telecommunications equipment by reducing noise and providing adequate protection against power system faults and lightning strikes.

This handbook emphasizes the necessity for including considerations of grounding, bonding, and shielding in all phases of design, construction, operation, and maintenance of electronic equipment and facilities. Volume 1, Basic Theory, develops the principles of personnel protection, fault protection, lightning protection, interference reduction, and EMP protection for C-E facilities. In addition, the basic theories of earth connections, signal grounding, electromagnetic shielding, and electrical bonding are presented. The subjects are not covered independently, rather they are considered from the standpoint of how they influence the design of the earth electrode Subsystem of a facility, the selection of ground reference networks for equipments and structures, shielding requirements, facility and equipment bonding practices, etc. Volume I also provides the basic background of theory and principles that explain the technical basis for the recommended practices and procedures; illustrates the necessity for care and thoroughness in implementation of grounding, bonding, and shielding; and provides supplemental information to assist in the solution of those problems and situations not specifically addressed.

In Volume II, Applications, the principles and theories, including RED/BLACK protection, are reduced to the practical steps and procedures which are to be followed in structural and facility development, electronic engineering, and in equipment development, These applications should assure personnel equipment and structural safety , minimize electromagnetic interference (EMI) problems in the final operating system; and minimize susceptibility to and generation of undesirable emanations. The emphasis in Volume II goes beyond development to assembly and construction, to installation and checkout, and to maintenance for long term use.

Four appendices are provided as common elements in both volumes. Appendix A is a glossary of selected words and terms as they are used herein, If not defined in the glossary, usage is in accordance with Federal Standard 1037, Glossary of Telecommunication Terms. Appendix B is a supplemental bibliography containing selected references intended to supply the user with additional material. Appendix C- contains the table of contents for the other volume. Appendix D contains the index for the two-volume set.