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MIL-P-55110 Revision E, December 22, 1993
Complete Document
Superseded By: MIL-PRF-55110
Includes all amendments and changes through Amendment 1, September 29, 1995
Additional Comments: CNCL S/S BY MIL-PRF-55110
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This specification establishes the qualification and performance requirements for rigid single-sided printed wiring boards, rigid double-sided printed wiring boards, and rigid multilayer printed wiring boards with plated through holes (see 6.1).

Printed wiring boards shall be of the types shown, as specified.
      Type 1 - Single-sided board.
      Type 2 - Double-sided board.
      Type 3 - Multilayer board.

This test method describes the method and procedure used to evaluate oxidation levels on solderable surfaces. The type and quantity of oxides on copper, tin, and lead surfaces have a significant impact on solderability. The procedure involves using electrochemical reduction techniques to determine the type and quantity of oxide on plated-through holes, attachment lands, and printed wiring board surface conductors. The SERA solderability test method is offered as an alternative to other solderability test methods required by this document. This test method shall not be contractually imposed upon either the contractor or sub-contractor.