MIL-PRF-31032/2 Revision B, November 2, 2012
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
Includes all amendments and changes through Amendment 1, November 2, 2012
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards, with or without plated holes, that will use soldering for component mounting. Printed wiring boards of other base material types or construction styles can be tested or verified to the performance requirements contained in this document, however, the performance parameters of other performance specifications sheets may be more appropriate.