MIL-STD-1310 Revision H, September 17, 2009
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY
Includes all amendments and changes through Validation Notice 1, August 12, 2014
This document specifies standard practices to facilitate achievement of the intra-ship and intership electromagnetic compatibility (EMC), electromagnetic pulse (EMP), bonding, and intermodulation interference (IMI) requirements of MIL-STD-464.
Application. The requirements specified herein apply to metal and nonmetallic hull ships and are applicable during ship construction, overhaul, alteration, and repair. Requirements herein may be invoked upon contractor and government (military and civilian) personnel.
Tailoring. The requirements herein may be tailored with NAVSEA 05H3, Navy technical warrant authority, approval.
New materials and technology. To achieve requirements of this standard while reducing lifecycle maintenance costs, implementation of new materials and technology is encouraged. The new materials and technology should not prevent the ship from meeting all applicable MIL-STD-464 E3 performance requirements, and must not introduce EMI or safety problems. An example of new shipboard bonding and grounding technology is a flexible infrastructure deck track system designed to provide equipment reconfigurability.