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MIL-I-24768/9

1992 Edition, February 25, 1992

Complete Document

INSULATION, PLASTIC, LAMINATED, THERMOSETTING, NYLON-FABRIC-BASE, PHENOLIC-RESIN (NPG)



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Description / Abstract:

The laminated material covered by this specification is a moisture and humidity resistant, plasic laminate designed for electronic applications. It has good impact strength but poor heat, flame, and arc resistance. This material shows severe decrease in flexural strength at temperatures above 75°C.