1970756

MIL MIL-STD-1310H

Shipboard Bonding, Grounding, and other Techniques for Electromagnetic Compatibility, Electromagnetic Pulse (EMP) Mitigation, and Safety

standard by Military Specifications and Standards , 09/17/2009

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About This Item

 

Full Description

This document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility (EMC), electromagnetic pulse (EMP), bonding, and intermodulation interference (IMI) requirements of MIL-STD-464.
 

Product Details

Published:
09/17/2009
Number of Pages:
46
File Size:
1 file , 530 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. MIL MIL-STD-1310H

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    Shipboard Bonding, Grounding, and other Techniques for Electromagnetic Compatibility, Electromagnetic Pulse (EMP) Mitigation, and Safety

    • Most Recent

  2. MIL MIL-STD-1310G


    SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY (SUPERSEDING MIL-STD-1310F)

    • Historical Version

  3. MIL MIL-STD-1310F


    SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY (S/S BY MIL-STD-1310G) (SUPERSEDING MIL-STD-1310E)

    • Historical Version

  4. MIL MIL-STD-1310E


    SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY (S/S BY MIL-STD-1310G) (SUPERSEDING MIL-STD-1310D)

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. MIL MIL-STD-1310H Notice 1 - Validation


    Shipboard Bonding, Grounding, and other Techniques for Electromagnetic Compatibility, Electromagnetic Pulse (EMP) Mitigation, and Safety