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NAS4123

1st Edition, November 30, 2016

Complete Document

HEAT SINK, ELECTRICAL-ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FOR DUAL INLINE PACKAGES (DIP)

Includes all amendments and changes through Reaffirmation Notice , November 30, 2016


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Product Details:

  • Revision: 1st Edition, November 30, 2016
  • Published Date: November 30, 2016
  • Status: Active, Most Current
  • Document Language:
  • Published By: Aerospace Industries Association (AIA/NAS)
  • Page Count: 16
  • ANSI Approved: No
  • DoD Adopted: No
  • FSC Code: 5999 - Miscellaneous Electrical and Electronic Components

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