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Improve chemical safety and emergency response using the 2022 edition of NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities.

The semiconductor industry continues to advance and new safeguards are required to address the ever-evolving hazards. NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities, applies to semiconductor fabrication facilities and comparable fabrication processes, including research and development (R&D) areas in which hazardous chemicals are used, stored, and handled and areas containing a cleanroom or clean zone.

The chapters in this standard address every aspect of safety, from general precautions and fire protection to construction, chemical storage and handling, hazardous gas cylinder storage and distribution, bulk silane systems, production and support equipment, emergency control stations, and means of egress.

The 2022 edition of NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities, can help all stakeholders involved in fire protection, including engineers, authorities having jurisdiction (AHJs), facility personnel, and contractors.

Several revisions were made for the 2022 edition of the standard. Those changes include the following:

• Tables for hazardous material quantity limits have been updated to clarify aggregate limits and allowable increases, as well as to reflect quantities utilized in fabrication facilities.
• A new requirement has been added for cabinets storing pyrophoric liquids to be protected by a fire control system.
• New annex material has been added listing the fire control performance requirements for pyrophoric liquid fires.
• New language has been added allowing bulk gas purge sources to be used in place of purge cylinders if specific criteria are met.
• High-sensitivity smoke detection has been added as an option for silane delivery systems.

Get the latest requirements for semiconductor fabrication facilities by ordering your copy of the 2022 edition of NFPA 318, Standard for the Protection of Semiconductor Fabrication Facilities, today. (Print, 44 pp., 2022)