Hello. Sign In
Standards Store


1996 Edition, August 1, 1996

Complete Document

Cleaning Compound, Terpene Circuit Board Cleaner

Detail Summary

Active, Most Current

Price (USD)
Single User
In Stock
Add to Cart

Product Details:

  • Revision: 1996 Edition, August 1, 1996
  • Published Date: August 1996
  • Status: Active, Most Current
  • Document Language: English
  • Published By: SAE International (SAE)
  • Page Count: 7
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:


1.1 Form:

This specification covers a terpene base solvent cleaner in the form of a liquid, which forms a transient emulsion with water.

1.2 Application:

The cleaner has been used typically for the removal of residual soldering flux and polar and non-polar contaminants from component populated circuit boards subsequent to soldering operations, but usage is not limited to such applications. The cleaner is used in in-line and batch cleaning systems with provisions for spray-under-immersion, ultrasonic immersion or immersion-spin cleaning, and with provisions for a water rinse.

1.3 Safety - Hazardous Materials:

While the materials, methods, applications, and processes described or referenced in this specification may involve the use of hazardous materials, this specification does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved.

1.4 Precautions:

Repeated contact with the skin can cause irritation. Use of solvent resistant gloves and eye shield protection is recommended. The cleaner is combustible and is a Class II liquid based on National Fire Protection Association (NFPA) Standards.

1.4.1 Conventional industrial aqueous cleaning equipment systems are not suitable for use with cleaning compound covered by this specification.

1.4.2 Marking inks for use on circuit boards, components, and other parts to be cleaned in terpene cleaning compounds should be of the cross-linked or polymerizing type.

1.4.3 Components, used on circuit boards to be cleaned in terpene cleaners must be capable of complete immersion in water in that thorough water rinsing is required for removal of residual cleaning compound.

1.4.4 Use of silicone rubber, natural rubber, neoprene rubber, rubber based adhesives, styrene, or polyvinyl chloride resins on circuit board assemblies or other parts, to be cleaned using cleaner in accordance with this specification, must be evaluated for compatibility with the cleaner.
AIA/NAS Aerospace Standards