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SAE AMS3619 Revision D, November 1, 2010
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Resin, Polyimide, Laminating High Temperature Resistant, 315 °C (599 °F)
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AIA/NAS Aerospace Standards

This specification covers a single-component, heat-reactive, thermosetting aromatic system which thermally cures to form a polyimide polymer structure.


This product has been used typically as a resin matrix for fiber-reinforced-composite parts requiring good strength after long-term exposure up to 315 °C (599 °F) and after short-term exposure up to 370 °C (698 °F), but usage is not limited to such applications.

Safety-Hazardous Materials

While the materials, methods, applications, and processes described or referenced in this specification may involve the use of hazardous materials, this specification does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved.