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Revision C, November 1, 2016

Complete Document

Adhesive Film, Hot-Melt, Addition-Type Polyimide for Foam Sandwich Structure, -55 to +230 Degrees C (-65 to +450 Degrees F)

Includes all amendments and changes through Stabilization Notice (No longer revised / updated) , November 2016

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Product Details:

  • Revision: Revision C, November 1, 2016
  • Published Date: November 2016
  • Status: Active, Most Current
  • Document Language: English
  • Published By: SAE International (SAE)
  • Page Count: 14
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

Form: This specification covers one type of hot-melt, addition-type, polyimide adhesive in the form of supported film furnished in rolls or cut sheets

Application: Primarily for structural adhesive bonding of foam sandwich and glass-fiber, honeycomb-core sandwich assemblies requiring high strength, excel lent electrical properties, and heat resistance up to 230°C (450°F)

AIA/NAS Aerospace Standards