SAE AMS3731/5 Revision C, September 1, 2016
Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
Includes all amendments and changes through Cancellation Notice , September 2016
Additional Comments: CNCL NO S/S
Published By:SAE International (SAE)
Form: This specification covers a filled, room- temperature-polymerizing epoxy resin formulation, supplied as a two-component system.
Application: Primarily for use as a potting or sealing material where a low coefficient of thermal expansion is desired.