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SAE AMS3731/5 Revision C, September 1, 2016
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Potting Compound, Epoxy Bisphenol A-Type Filled, Room Temperature Cure, Low Exotherm
Includes all amendments and changes through Cancellation Notice , September 2016
Additional Comments: CNCL NO S/S
Page Count:4
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AIA/NAS Aerospace Standards
Form: This specification covers a filled, room- temperature-polymerizing epoxy resin formulation, supplied as a two-component system.

Application: Primarily for use as a potting or sealing material where a low coefficient of thermal expansion is desired.