Revision C, September 1, 2016
Potting Compound, Epoxy Bisphenol A-Type Syntactic Foam, Heat Cure
Includes all amendments and changes through Cancellation Notice , September 2016
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Description / Abstract:
Form: This specification covers a glass or silica microsphere-filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.