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SAE ARP1332

Revision D, August 2013

Complete Document

Wave Soldering Procedure

Includes all amendments and changes through Stabilization Notice (No longer revised / updated) , August 2013


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Product Details:

  • Revision: Revision D, August 2013
  • Published Date: August 2013
  • Status: Active, Most Current
  • Document Language: English
  • Published By: SAE International (SAE)
  • Page Count: 13
  • ANSI Approved: No
  • DoD Adopted: No

Description / Abstract:

The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. 

The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures that have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards.

In the following text, references to printed circuit (PC) boards shall be construed to include printed wire (PW) boards.

Safety-Hazardous Materials

While the materials, methods, applications and processes described or referenced in this procedure may involve the use of hazardous materials, this document does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved. 

Warning

The solder used in this document may contain cadmium. The use of cadmium has been restricted and/or banned for use in many countries due to environmental and health concerns. The user should consult with local officials on applicable health and environmental regulations regarding its use.
AIA/NAS Aerospace Standards