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89th Edition, January 1, 1989

Complete Document

Application of Direct Pressure to Resin in Curing of Epoxy and Addition Type Polyimides

Includes all amendments and changes through Reaffirmation Notice , August 2014

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Product Details:

  • Revision: 89th Edition, January 1, 1989
  • Published Date: August 2014
  • Status: Active, Most Current
  • Document Language: English
  • Published By: SAE International (SAE)
  • Page Count: 10
  • ANSI Approved: No
  • DoD Adopted: Yes

Description / Abstract:

This recommended practice describes the material, related equipment, and particular processing technique utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix "A" to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures.

An understanding of the processing philosophy resented in Appendix "A" is important because the approaches techniques used in processing composite hardware presented in this ARP are unique compared to normal industry practice.
AIA/NAS Aerospace Standards