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IPC-7711/7721

Revision B, November 2007

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REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES

Includes all amendments and changes through Change/Amendment , November 2007


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Description / Abstract:

This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance Committee of the IPC. This revision includes expanded coverage for lead free processes, and additional inspection guidelines for operations such as repair that may not have other published criteria. This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly.