J-STD-033 Revision B, October 1, 2005
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Includes all amendments and changes through Amendment 1, January 2007
Published By:Association Connecting Electronics Industries (IPC)
Nonhermetic This standard applies to all nonhermetic SMD packages subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other packages made with moisture-permeable polymeric materials (epoxies, silicones, etc.) that are exposed to the ambient air.
Hermetic Hermetic SMD packages are not moisture sensitive and do not require moisture precautionary handling.
Purpose The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMD packages that have been classified to the levels defined in J-STD-020. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags of 12 months from the seal date.