Hello. Sign In
Standards Store




IPC-6012

Revision B, January 2007

Complete Document

Qualification and Performance Specification for Rigid Printed Boards



View Abstract
Product Details
Document History
Format
Details
Price (USD)
Secure PDF
Single User
Call for Quote
Print
In Stock
Call for Quote
PDF + Print
In Stock
$0.00 You save 20%
Add to Cart

Product Details:


Description / Abstract:

Statement of Scope This specification covers qualification and performance of rigid printed boards. The printed board may be single-sided, double-sided, with or without plated-through holes. The printed board may be multilayer with plated-through holes and with or without buried/blind vias. The printed board may be multilayer containing build up HDI layers conforming to IPC-6016. The printed board may contain active embedded passive circuitry with distributive capacitive planes, capacitive or resistive components. The printed board may contain a metal core or external metal heat frame, which may be active or nonactive. Revision level changes are described in 1.6.

Purpose The purpose of this specification is to provide requirements for qualification and performance of rigid printed boards.