Your search resulted in 527 documents for "JEDEC" amongst all current documents.

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  1. MOST RECENT

    2005378

    IEC 60749-26 Ed. 4.0 b:2018

    Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

    standard by International Electrotechnical Commission, 01/15/2018.

    Languages: English, French

    Historical Editions: IEC 60749-26 Ed. 3.0 b:2013IEC 60749-26 Ed. 2.0 b:2006IEC 60749-26 Ed. 1.0 b:2003

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  2. IEC/TS 62686-1 Ed. 3.0 en:2020

    Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

    standard by International Electrotechnical Commission - Technical Standard, 04/20/2020.

    Languages: English

    Historical Editions: IEC/TS 62686-1 Ed. 2.0 en:2015IEC/TS 62686-1 Ed. 1.0 en:2012

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  3. IEC/TR 60068-3-12 Ed. 3.0 en:2022

    Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

    standard by International Electrotechnical Commission - Technical Report, 10/01/2022.

    Languages: English

    Historical Editions: IEC/TR 60068-3-12 Ed. 2.0 b:2014IEC/TR 60068-3-12 Ed. 1.0 en:2007

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  4. MOST RECENT

    1866442

    IEC 62483 Ed. 1.0 b:2013

    Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

    standard by International Electrotechnical Commission, 09/25/2013.

    Languages: English, French

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  5. MOST RECENT

    1870442

    IPC JEDEC-9704A

    Printed Circuit Assembly Strain Gage Test Guideline

    standard by Association Connecting Electronics Industries, 02/01/2012 in English, Chinese.

    Languages: Chinese,English

    Historical Editions: IPC 9704

  6. MOST RECENT

    1922110

    JEDEC JESD46D

    CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY ELECTRONIC PRODUCT SUPPLIERS

    standard by JEDEC Solid State Technology Association, .

    Languages: English

    Historical Editions: JEDEC JESD46DJEDEC JESD 46C

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  7. MOST RECENT

    1889937

    JEDEC J-STD-048

    Notification Standard for Product Discontinuance

    standard by JEDEC Solid State Technology Association, 11/01/2014.

    Languages: English

    Historical Editions: JEDEC JESD48CJEDEC JESD 48B

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  8. MOST RECENT

    1779507

    JEDEC JS 9702

    IPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)

    standard by JEDEC Solid State Technology Association, 06/01/2004.

    Languages: English

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  9. MOST RECENT

    1930795

    JEDEC JEP122H

    Failure Mechanisms and Models for Semiconductor Devices

    standard by JEDEC Solid State Technology Association, 09/01/2016.

    Languages: English

    Historical Editions: JEDEC JEP122GJEDEC JEP 122FJEDEC JEP 122E

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  10. MOST RECENT

    1779508

    JEDEC JS 9703

    IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliability

    standard by JEDEC Solid State Technology Association, 03/01/2009.

    Languages: English

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