Your search resulted in 184 documents for "J-STD" amongst all current documents.

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  1. MOST RECENT

    2192799

    IPC J-STD-001H

    Requirements for Soldered Electrical and Electronic Assemblies

    standard by Association Connecting Electronics Industries, 09/01/2020 in English, Chinese, French, Vietnamese, Danish, German.

    Languages: Chinese,Danish,English,French,German ,Vietnamese

    Amendments, rulings, and supplements: IPC J-STD-001HA/IPC-A-610HAIPC J-STD-001HS

    Historical Editions: IPC J-STD-001GIPC J-STD-001F-WAM1IPC J-STD-001FIPC J-STD-001EIPC J-STD-001DIPC J-STD-001CIPC J-STD-001B

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  2. MOST RECENT

    2192798

    IPC A-610H

    Acceptability of Electronic Assemblies

    standard by Association Connecting Electronics Industries, 09/01/2020 in English, Vietnamese, Japanese, Danish, Spanish, French, Chinese, Romanian, Hungarian.

    Languages: Chinese,Danish,English,French,Hungarian,Japanese,Romanian,Spanish,Vietnamese

    Amendments, rulings, and supplements: IPC IPC-A-610HCIPC J-STD-001HA/IPC-A-610HA

    Historical Editions: IPC A-610GIPC A-610F-WAM1

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  3. MOST RECENT

    2031476

    IPC J-STD-002E

    Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

    standard by Association Connecting Electronics Industries, 11/01/2017 in Japanese, English, Chinese.

    Languages: Chinese,English,Japanese

    Historical Editions: IPC J-STD-002DIPC J-STD-002CIPC J-STD-002B

  4. MOST RECENT

    2524368

    IPC J-STD-004C WAM1

    Requirements for Soldering Fluxes

    standard by Association Connecting Electronics Industries, 09/01/2022.

    Languages: English

    Historical Editions: IPC J-STD-004CIPC J-STD-004B-WAM1IPC J-STD-004BIPC J-STD-004AIPC J-STD-004MIL MIL-F-14256

  5. MOST RECENT

    2524369

    IPC J-STD-003D

    Solderability Tests for Printed Boards

    standard by Association Connecting Electronics Industries, 10/01/2022 in English, Chinese.

    Languages: Chinese,English

    Historical Editions: IPC J-STD-003C-WAM1&2IPC J-STD-003C-WAM1IPC J-STD-003CIPC J-STD-003BIPC J-STD-003AIPC J-STD-003

  6. MOST RECENT

    1889937

    JEDEC J-STD-048

    Notification Standard for Product Discontinuance

    standard by JEDEC Solid State Technology Association, 11/01/2014.

    Languages: English

    Historical Editions: JEDEC JESD48CJEDEC JESD 48B

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  7. MOST RECENT

    1038585

    IPC J-STD-032

    Performance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)

    standard by Association Connecting Electronics Industries, 06/01/2002.

    Languages: English

  8. MOST RECENT

    17280

    IPC J-STD-012

    Implementation of Flip Chip and Chip Scale Technology

    standard by Association Connecting Electronics Industries, 01/01/1996.

    Languages: English

  9. MOST RECENT

    2045361

    ATIS J-STD-100

    Joint ATIS/TIA CMAS Mobile Device Behavior Specification

    standard by The Alliance for Telecommunications Industry Solutions, 01/01/2009.

    Languages: English

    Amendments, rulings, and supplements: ATIS J-STD-100.a

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  10. MOST RECENT

    235646

    IPC J-STD-028

    Performance Standard fo Construction of Flip Chip and Chip Scale Bumps

    standard by Association Connecting Electronics Industries, 04/01/1999.

    Languages: English