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Standards Referenced in IPC/ECA J-STD-002

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A-A-59551 Revision A, October 22, 2009
WIRE, ELECTRICAL, COPPER (UNINSULATED)
Includes all amendments and changes through Validation Notice 1, March 31, 2016

A-A-59551

Revision A, October 22, 2009

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WIRE, ELECTRICAL, COPPER (UNINSULATED)
Includes all amendments and changes through Validation Notice 1, March 31, 2016
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IEC 60068-2-69 3rd Edition, March 2017
ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
Includes all amendments and changes through Corrigendum 1, January 2018

IEC 60068-2-69

3rd Edition, March 2017

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ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
Includes all amendments and changes through Corrigendum 1, January 2018
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BILINGUAL
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J-STD-004 Revision B, December 2008
Requirements for Soldering Fluxes
Includes all amendments and changes through Amendment 1, November 2011

J-STD-004

Revision B, December 2008

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Requirements for Soldering Fluxes
Includes all amendments and changes through Amendment 1, November 2011
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CONTAINS COLOR * PDF ONLY
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J-STD-005 Revision A, February 2012
Requirements for Soldering Pastes

J-STD-005

Revision A, February 2012

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Requirements for Soldering Pastes
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J-STD-006 Revision C, July 2013
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Includes all amendments and changes through Amendment 1, October 2017

J-STD-006

Revision C, July 2013

Complete Document
 
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Includes all amendments and changes through Amendment 1, October 2017
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IPC-T-50 Revision M, May 2015
Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-T-50

Revision M, May 2015

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Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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IPC-TM-650 2007 Edition, January 2007
TEST METHODS MANUAL

IPC-TM-650

2007 Edition, January 2007

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TEST METHODS MANUAL
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IPC-TR-464 1984 Edition, April 1984
Accelerated Aging for Solderability Evaluations

IPC-TR-464

1984 Edition, April 1984

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Accelerated Aging for Solderability Evaluations
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