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Document History for IPC/JEDEC J-STD-033 CH

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IPC/JEDEC J-STD-033 CH Revision D, April 2018
Complete Document
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
(Document Language: Chinese)

IPC/JEDEC J-STD-033 CH

Revision D, April 2018

Complete Document
 
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Active, Most Current
ZH
Additional Comments:
SAME AS JEDEC J-STD-033
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IPC/JEDEC J-STD-033 CH Revision C, September 2013
Complete Document
SOLDERABILITY TESTS FOR PRINTED BOARDS
(Document Language: Chinese)

IPC/JEDEC J-STD-033 CH

Revision C, September 2013

Complete Document
 
SOLDERABILITY TESTS FOR PRINTED BOARDS
Additional Comments:
CHINESE
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