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JEDEC J-STD-033 Revision C-1, August 1, 2014
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

JEDEC J-STD-033

Revision C-1, August 1, 2014

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Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
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SAME AS J-STD-033
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JEDEC JESD 22-A110 Revision E, July 1, 2015
Highly Accelerated Temperature and Humidity Stress Test (HAST)

JEDEC JESD 22-A110

Revision E, July 1, 2015

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Highly Accelerated Temperature and Humidity Stress Test (HAST)
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JEDEC JESD 22-A114 Revision F, December 1, 2008
Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)

JEDEC JESD 22-A114

Revision F, December 1, 2008

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Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)
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W/D S/S BY JEDEC JS-001
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JEDEC JS-001 2017 Edition, January 1, 2017
Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Component Level

JEDEC JS-001

2017 Edition, January 1, 2017

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Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Component Level
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SAME AS ESDA/JEDEC JS-001
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JEDEC JESD 625 Revision B, January 1, 2012
Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices

JEDEC JESD 625

Revision B, January 1, 2012

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Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
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J-STD-020 Revision E, December 1, 2014
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

J-STD-020

Revision E, December 1, 2014

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Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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JEDEC JESD 201 Revision A, September 1, 2008
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014

JEDEC JESD 201

Revision A, September 1, 2008

Complete Document
 
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014
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JEDEC JESD 22-A104 Revision E, October 1, 2014
Temperature Cycling

JEDEC JESD 22-A104

Revision E, October 1, 2014

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Temperature Cycling
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JEDEC JESD 22-A121 Revision A, July 1, 2008
Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014

JEDEC JESD 22-A121

Revision A, July 1, 2008

Complete Document
 
Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014
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JEDEC JESD 22-B116 Revision B, April 1, 2017
Wire Bond Shear Test Method

JEDEC JESD 22-B116

Revision B, April 1, 2017

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Wire Bond Shear Test Method
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JEDEC JEP 001 Revision A, February 1, 2014
FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)

JEDEC JEP 001

Revision A, February 1, 2014

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FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)
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JEDEC JEP 140 2nd Edition, June 1, 2002
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
Includes all amendments and changes through Reaffirmation Notice , January 2015

JEDEC JEP 140

2nd Edition, June 1, 2002

Complete Document
 
Beaded Thermocouple Temperature Measurement of Semiconductor Packages
Includes all amendments and changes through Reaffirmation Notice , January 2015
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JEDEC JESD 79-3 Revision F, July 1, 2012
DDR3 SDRAM Specification

JEDEC JESD 79-3

Revision F, July 1, 2012

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DDR3 SDRAM Specification
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JEDEC JESD 9 Revision C, May 1, 2017
Inspection Criteria for Microelectronic Packages and Covers

JEDEC JESD 9

Revision C, May 1, 2017

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Inspection Criteria for Microelectronic Packages and Covers
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JEDEC JESD 94 Revision B, October 1, 2015
Application Specific Qualification Using Knowledge Based Test Methodology

JEDEC JESD 94

Revision B, October 1, 2015

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Application Specific Qualification Using Knowledge Based Test Methodology
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JEDEC JESD 218 Revision B, June 1, 2016
Solid-State Drive (SSD) Requirements and Endurance Test Method
Includes all amendments and changes through 01, June 2016

JEDEC JESD 218

Revision B, June 1, 2016

Complete Document
 
Solid-State Drive (SSD) Requirements and Endurance Test Method
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JEDEC JEP 154 2008 Edition, January 1, 2008
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
Includes all amendments and changes through Reaffirmation Notice , June 2011

JEDEC JEP 154

2008 Edition, January 1, 2008

Complete Document
 
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
Includes all amendments and changes through Reaffirmation Notice , June 2011
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JEDEC JESD 51-14 2010 Edition, November 1, 2010
Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path

JEDEC JESD 51-14

2010 Edition, November 1, 2010

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Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path
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JEDEC JESD 22-B113 Revision A, September 1, 2012
Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products

JEDEC JESD 22-B113

Revision A, September 1, 2012

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Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products
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JEDEC JESD 22-A113 Revision H, November 1, 2016
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

JEDEC JESD 22-A113

Revision H, November 1, 2016

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Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
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