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JEDEC J-STD-033 Revision D, April 2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

JEDEC J-STD-033

Revision D, April 2018

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Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
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JEDEC JESD 47 Revision K, August 2018
Stress-Test-Driven Qualification of Integrated Circuits

JEDEC JESD 47

Revision K, August 2018

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Stress-Test-Driven Qualification of Integrated Circuits
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JEDEC JEP 122 Revision H, September 2016
Failure Mechanisms and Models for Semiconductor Devices

JEDEC JEP 122

Revision H, September 2016

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Failure Mechanisms and Models for Semiconductor Devices
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JEDEC JESD 22-B116 Revision B, April 2017
Wire Bond Shear Test Method

JEDEC JESD 22-B116

Revision B, April 2017

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Wire Bond Shear Test Method
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JEDEC JESD 201 Revision A, September 2008
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014

JEDEC JESD 201

Revision A, September 2008

Complete Document
 
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
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JEDEC JESD 22-A104 Revision E, October 2014
Temperature Cycling

JEDEC JESD 22-A104

Revision E, October 2014

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Temperature Cycling
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JEDEC J-STD-046 2016 Edition, July 2016
Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

JEDEC J-STD-046

2016 Edition, July 2016

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Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers
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JEDEC JESD 94 Revision B, October 2015
Application Specific Qualification Using Knowledge Based Test Methodology

JEDEC JESD 94

Revision B, October 2015

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Application Specific Qualification Using Knowledge Based Test Methodology
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JEDEC JESD 625 Revision B, January 2012
Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices

JEDEC JESD 625

Revision B, January 2012

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Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
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JEDEC J-STD-609 Revision B, April 2016
Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
Includes all amendments and changes through Change/Amendment , April 2016

JEDEC J-STD-609

Revision B, April 2016

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Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
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JEDEC JESD 22-A101 Revision D, July 2015
Steady-State Temperature-Humidity Bias Life Test

JEDEC JESD 22-A101

Revision D, July 2015

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Steady-State Temperature-Humidity Bias Life Test
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JEDEC JESD 209-4 Revision B, February 2017
Low Power Double Date Rate 4 (LPDDR4)

JEDEC JESD 209-4

Revision B, February 2017

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Low Power Double Date Rate 4 (LPDDR4)
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JEDEC JESD 79-4 Revision B, June 2017
DDR4 SDRAM

JEDEC JESD 79-4

Revision B, June 2017

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DDR4 SDRAM
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JEDEC JESD 79-3 Revision F, July 2012
DDR3 SDRAM Specification

JEDEC JESD 79-3

Revision F, July 2012

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DDR3 SDRAM Specification
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JEDEC JESD 220 Revision D, January 2018
Universal Flash Storage (UFS) Version 3.0

JEDEC JESD 220

Revision D, January 2018

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Universal Flash Storage (UFS) Version 3.0
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JEDEC JS-001 2017 Edition, 2017
Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Component Level

JEDEC JS-001

2017 Edition, 2017

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Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Component Level
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JEDEC JESD 51-14 2010 Edition, November 2010
Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path

JEDEC JESD 51-14

2010 Edition, November 2010

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Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path
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JEDEC J-STD-020 Revision E, December 2014
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

JEDEC J-STD-020

Revision E, December 2014

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Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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JEDEC JESD 22-A121 Revision A, July 2008
Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014

JEDEC JESD 22-A121

Revision A, July 2008

Complete Document
 
Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
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JEDEC JESD 22-B112 Revision B, August 2018
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature

JEDEC JESD 22-B112

Revision B, August 2018

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Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
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