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JEDEC J-STD-033 Revision C-1, August 1, 2014
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

JEDEC J-STD-033

Revision C-1, August 1, 2014

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Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
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SAME AS J-STD-033
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JEDEC JESD 22-A110 Revision E, July 1, 2015
Highly Accelerated Temperature and Humidity Stress Test (HAST)

JEDEC JESD 22-A110

Revision E, July 1, 2015

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Highly Accelerated Temperature and Humidity Stress Test (HAST)
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JEDEC JESD 22-B110 Revision B, July 1, 2013
Mechanical Shock – Component and Subassembly

JEDEC JESD 22-B110

Revision B, July 1, 2013

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Mechanical Shock – Component and Subassembly
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JEDEC JS-001 2017 Edition, January 1, 2017
Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Component Level

JEDEC JS-001

2017 Edition, January 1, 2017

Complete Document
 
Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Component Level
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SAME AS ESDA/JEDEC JS-001
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JEDEC JESD 22-A104 Revision E, October 1, 2014
Temperature Cycling

JEDEC JESD 22-A104

Revision E, October 1, 2014

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Temperature Cycling
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JEDEC JESD 22-A114 Revision F, December 1, 2008
Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)

JEDEC JESD 22-A114

Revision F, December 1, 2008

Complete Document
 
Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)
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W/D S/S BY JEDEC JS-001
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JEDEC JESD 22-A121 Revision A, July 1, 2008
Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014

JEDEC JESD 22-A121

Revision A, July 1, 2008

Complete Document
 
Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014
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JEDEC JESD 94 Revision B, October 1, 2015
Application Specific Qualification Using Knowledge Based Test Methodology

JEDEC JESD 94

Revision B, October 1, 2015

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Application Specific Qualification Using Knowledge Based Test Methodology
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J-STD-020 Revision E, December 1, 2014
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

J-STD-020

Revision E, December 1, 2014

Complete Document
 
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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SAME AS JEDEC J-STD-020
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JEDEC JESD 201 Revision A, September 1, 2008
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014

JEDEC JESD 201

Revision A, September 1, 2008

Complete Document
 
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014
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JEDEC J-STD-609 Revision B, April 1, 2016
Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
Includes all amendments and changes through Change/Amendment , April 2016

JEDEC J-STD-609

Revision B, April 1, 2016

Complete Document
 
Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
Includes all amendments and changes through Change/Amendment , April 2016
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JEDEC JESD 22-A108 Revision F, July 1, 2017
Temperature, Bias, and Operating Life

JEDEC JESD 22-A108

Revision F, July 1, 2017

Complete Document
 
Temperature, Bias, and Operating Life
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JEDEC J-STD-046 2016 Edition, July 1, 2016
Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

JEDEC J-STD-046

2016 Edition, July 1, 2016

Complete Document
 
Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers
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SAME AS IPC J-STD-046
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JEDEC JESD 22-A105 Revision C, January 1, 2004
Power and Temperature Cycling
Includes all amendments and changes through Reaffirmation Notice , January 2011

JEDEC JESD 22-A105

Revision C, January 1, 2004

Complete Document
 
Power and Temperature Cycling
Includes all amendments and changes through Reaffirmation Notice , January 2011
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JEDEC JESD 9 Revision C, May 1, 2017
Inspection Criteria for Microelectronic Packages and Covers

JEDEC JESD 9

Revision C, May 1, 2017

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Inspection Criteria for Microelectronic Packages and Covers
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JEDEC JESD 47 Revision J, September 1, 2017
Stress-Test-Driven Qualification of Integrated Circuits
Includes all amendments and changes through 01, September 2017

JEDEC JESD 47

Revision J, September 1, 2017

Complete Document
 
Stress-Test-Driven Qualification of Integrated Circuits
Includes all amendments and changes through 01, September 2017
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JEDEC JESD 221 2011 Edition, May 1, 2011
Alpha Radiation Measurement in Electronic Materials

JEDEC JESD 221

2011 Edition, May 1, 2011

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Alpha Radiation Measurement in Electronic Materials
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JEDEC JESD 625 Revision B, January 1, 2012
Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices

JEDEC JESD 625

Revision B, January 1, 2012

Complete Document
 
Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
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JEDEC JESD 51-14 2010 Edition, November 1, 2010
Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path

JEDEC JESD 51-14

2010 Edition, November 1, 2010

Complete Document
 
Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path
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JEDEC JESD 22-B116 Revision B, April 1, 2017
Wire Bond Shear Test Method

JEDEC JESD 22-B116

Revision B, April 1, 2017

Complete Document
 
Wire Bond Shear Test Method
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