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JEDEC JESD 22-A104 Revision E, October 1, 2014
Temperature Cycling

JEDEC JESD 22-A104

Revision E, October 1, 2014

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Temperature Cycling
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JEDEC J-STD-033 Revision D, April 1, 2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

JEDEC J-STD-033

Revision D, April 1, 2018

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Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
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SAME AS J-STD-033
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JEDEC JESD 22-A101 Revision D, July 1, 2015
Steady-State Temperature-Humidity Bias Life Test

JEDEC JESD 22-A101

Revision D, July 1, 2015

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Steady-State Temperature-Humidity Bias Life Test
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JEDEC J-STD-046 2016 Edition, July 1, 2016
Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

JEDEC J-STD-046

2016 Edition, July 1, 2016

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Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers
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Additional Comments:
SAME AS IPC J-STD-046
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JEDEC JESD 22-A108 Revision F, July 1, 2017
Temperature, Bias, and Operating Life

JEDEC JESD 22-A108

Revision F, July 1, 2017

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Temperature, Bias, and Operating Life
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JEDEC JESD 51-14 2010 Edition, November 1, 2010
Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path

JEDEC JESD 51-14

2010 Edition, November 1, 2010

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Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path
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JEDEC JESD 47 Revision K, August 1, 2018
Stress-Test-Driven Qualification of Integrated Circuits

JEDEC JESD 47

Revision K, August 1, 2018

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Stress-Test-Driven Qualification of Integrated Circuits
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JEDEC JESD 22-A110 Revision E, July 1, 2015
Highly Accelerated Temperature and Humidity Stress Test (HAST)

JEDEC JESD 22-A110

Revision E, July 1, 2015

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Highly Accelerated Temperature and Humidity Stress Test (HAST)
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JEDEC JESD 22-A103 Revision E, October 1, 2015
High Temperature Storage Life

JEDEC JESD 22-A103

Revision E, October 1, 2015

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High Temperature Storage Life
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JEDEC JEP 122 Revision H, September 1, 2016
Failure Mechanisms and Models for Semiconductor Devices

JEDEC JEP 122

Revision H, September 1, 2016

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Failure Mechanisms and Models for Semiconductor Devices
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JEDEC J-STD-020 Revision E, December 1, 2014
Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

JEDEC J-STD-020

Revision E, December 1, 2014

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Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
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SAME AS IPC/JEDEC J-STD-020
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JEDEC JESD 625 Revision B, January 1, 2012
Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices

JEDEC JESD 625

Revision B, January 1, 2012

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Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
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JEDEC JESD 201 Revision A, September 1, 2008
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014

JEDEC JESD 201

Revision A, September 1, 2008

Complete Document
 
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014
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JEDEC J-STD-609 Revision B, April 1, 2016
Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
Includes all amendments and changes through Change/Amendment , April 2016

JEDEC J-STD-609

Revision B, April 1, 2016

Complete Document
 
Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
Includes all amendments and changes through Change/Amendment , April 2016
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JEDEC JESD 22-A118 Revision B, July 1, 2015
Accelerated Moisture Resistance - Unbiased HAST

JEDEC JESD 22-A118

Revision B, July 1, 2015

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Accelerated Moisture Resistance - Unbiased HAST
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JEDEC JESD 61 Revision A, October 1, 2007
Isothermal Electromigration Test Procedure
Includes all amendments and changes through 01, October 2007

JEDEC JESD 61

Revision A, October 1, 2007

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Isothermal Electromigration Test Procedure
Includes all amendments and changes through 01, October 2007
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JEDEC JESD 213 Revision A, April 1, 2017
Standard Test Method Utilizing X-Ray Fluorescence (XRF) for Analyzing Component Finishes and Solder Alloys to Determine Tin (Sn) – Lead (Pb) Content

JEDEC JESD 213

Revision A, April 1, 2017

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Standard Test Method Utilizing X-Ray Fluorescence (XRF) for Analyzing Component Finishes and Solder Alloys to Determine Tin (Sn) – Lead (Pb) Content
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JEDEC JESD 46 Revision D, December 1, 2011
Customer Notification of Product/Process Changes by Solid-State Suppliers
Includes all amendments and changes through Change/Amendment , December 2011

JEDEC JESD 46

Revision D, December 1, 2011

Complete Document
 
Customer Notification of Product/Process Changes by Solid-State Suppliers
Includes all amendments and changes through Change/Amendment , December 2011
Additional Comments:
W/D S/S BY JEDEC J-STD-046
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JEDEC JESD 220 Revision D, January 1, 2018
Universal Flash Storage (UFS) Version 3.0

JEDEC JESD 220

Revision D, January 1, 2018

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Universal Flash Storage (UFS) Version 3.0
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JEDEC JESD 79-4 Revision B, June 1, 2017
DDR4 SDRAM

JEDEC JESD 79-4

Revision B, June 1, 2017

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DDR4 SDRAM
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