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JEDEC J-STD-033 Revision D, April 1, 2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

JEDEC J-STD-033

Revision D, April 1, 2018

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Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
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SAME AS J-STD-033
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JEDEC JESD 22-A104 Revision E, October 1, 2014
Temperature Cycling

JEDEC JESD 22-A104

Revision E, October 1, 2014

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Temperature Cycling
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JEDEC JESD 22-A101 Revision D, July 1, 2015
Steady-State Temperature-Humidity Bias Life Test

JEDEC JESD 22-A101

Revision D, July 1, 2015

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Steady-State Temperature-Humidity Bias Life Test
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JEDEC JESD 22-A108 Revision F, July 1, 2017
Temperature, Bias, and Operating Life

JEDEC JESD 22-A108

Revision F, July 1, 2017

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Temperature, Bias, and Operating Life
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JEDEC JESD 22-A110 Revision E, July 1, 2015
Highly Accelerated Temperature and Humidity Stress Test (HAST)

JEDEC JESD 22-A110

Revision E, July 1, 2015

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Highly Accelerated Temperature and Humidity Stress Test (HAST)
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JEDEC JESD 22-A103 Revision E, October 1, 2015
High Temperature Storage Life

JEDEC JESD 22-A103

Revision E, October 1, 2015

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High Temperature Storage Life
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JEDEC JESD 51-14 2010 Edition, November 1, 2010
Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path

JEDEC JESD 51-14

2010 Edition, November 1, 2010

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Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction to Case of Semiconductor Devices with Heat Flow Trough a Single Path
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JEDEC JESD 22-A105 Revision C, January 1, 2004
Power and Temperature Cycling
Includes all amendments and changes through Reaffirmation Notice , January 2011

JEDEC JESD 22-A105

Revision C, January 1, 2004

Complete Document
 
Power and Temperature Cycling
Includes all amendments and changes through Reaffirmation Notice , January 2011
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JEDEC JESD 213 Revision A, April 1, 2017
Standard Test Method Utilizing X-Ray Fluorescence (XRF) for Analyzing Component Finishes and Solder Alloys to Determine Tin (Sn) – Lead (Pb) Content

JEDEC JESD 213

Revision A, April 1, 2017

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Standard Test Method Utilizing X-Ray Fluorescence (XRF) for Analyzing Component Finishes and Solder Alloys to Determine Tin (Sn) – Lead (Pb) Content
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JEDEC JESD 22-B110 Revision B, July 1, 2013
Mechanical Shock – Component and Subassembly

JEDEC JESD 22-B110

Revision B, July 1, 2013

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Mechanical Shock – Component and Subassembly
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JEDEC JESD 46 Revision D, December 1, 2011
Customer Notification of Product/Process Changes by Solid-State Suppliers
Includes all amendments and changes through Change/Amendment , December 2011

JEDEC JESD 46

Revision D, December 1, 2011

Complete Document
 
Customer Notification of Product/Process Changes by Solid-State Suppliers
Includes all amendments and changes through Change/Amendment , December 2011
Additional Comments:
W/D S/S BY JEDEC J-STD-046
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JEDEC JS-001 2017 Edition, January 1, 2017
Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Component Level

JEDEC JS-001

2017 Edition, January 1, 2017

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Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Component Level
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SAME AS ESDA/JEDEC JS-001
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JEDEC JESD 201 Revision A, September 1, 2008
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014

JEDEC JESD 201

Revision A, September 1, 2008

Complete Document
 
Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes
Includes all amendments and changes through Reaffirmation Notice , May 2014
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JEDEC J-STD-609 Revision B, April 1, 2016
Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
Includes all amendments and changes through Change/Amendment , April 2016

JEDEC J-STD-609

Revision B, April 1, 2016

Complete Document
 
Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly
Includes all amendments and changes through Change/Amendment , April 2016
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JEDEC J-STD-046 2016 Edition, July 1, 2016
Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

JEDEC J-STD-046

2016 Edition, July 1, 2016

Complete Document
 
Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers
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Additional Comments:
SAME AS IPC J-STD-046
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JEDEC JESD 61 Revision A, October 1, 2007
Isothermal Electromigration Test Procedure
Includes all amendments and changes through 01, October 2007

JEDEC JESD 61

Revision A, October 1, 2007

Complete Document
 
Isothermal Electromigration Test Procedure
Includes all amendments and changes through 01, October 2007
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JEDEC JESD 220 Revision D, January 1, 2018
Universal Flash Storage (UFS) Version 3.0

JEDEC JESD 220

Revision D, January 1, 2018

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Universal Flash Storage (UFS) Version 3.0
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JEDEC JESD 79-4 Revision B, June 1, 2017
DDR4 SDRAM

JEDEC JESD 79-4

Revision B, June 1, 2017

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DDR4 SDRAM
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JEDEC JESD 9 Revision C, May 1, 2017
Inspection Criteria for Microelectronic Packages and Covers

JEDEC JESD 9

Revision C, May 1, 2017

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Inspection Criteria for Microelectronic Packages and Covers
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JEDEC JEP 122 Revision H, September 1, 2016
Failure Mechanisms and Models for Semiconductor Devices

JEDEC JEP 122

Revision H, September 1, 2016

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Failure Mechanisms and Models for Semiconductor Devices
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