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J-STD-001 Revision G, October 2017
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
Includes all amendments and changes through Amendment 1, September 2018

J-STD-001

Revision G, October 2017

Complete Document
 
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
Includes all amendments and changes through Amendment 1, September 2018
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CONTAINS COLOR * MUST BE PURCHASE WITH IPC-WP-019
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IPC-A-610 Revision G, October 2017
ACCEPTABILITY OF ELECTRONIC ASSEMBLIES

IPC-A-610

Revision G, October 2017

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ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
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IPC/WHMA-A-620 Revision C, January 2017
Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/WHMA-A-620

Revision C, January 2017

Base Document
 
Requirements and Acceptance for Cable and Wire Harness Assemblies
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IPC/ECA J-STD-002 Revision E, November 2017
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC/ECA J-STD-002

Revision E, November 2017

Complete Document
 
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
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CONTAINS COLOR
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IPC-A-600 Revision J, May 2016
Acceptability of Printed Boards

IPC-A-600

Revision J, May 2016

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Acceptability of Printed Boards
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Additional Comments:
SEE ALSO IPC-A-610
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J-STD-006 Revision C, July 2013
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Includes all amendments and changes through Amendment 1, October 2017

J-STD-006

Revision C, July 2013

Complete Document
 
REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
Includes all amendments and changes through Amendment 1, October 2017
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J-STD-004 Revision B, December 2008
Requirements for Soldering Fluxes
Includes all amendments and changes through Amendment 1, November 2011

J-STD-004

Revision B, December 2008

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Requirements for Soldering Fluxes
Includes all amendments and changes through Amendment 1, November 2011
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IPC-6012 Revision D, September 2015
Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
Includes all amendments and changes through Amendment 1, December 2018

IPC-6012

Revision D, September 2015

Complete Document
 
Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
Includes all amendments and changes through Amendment 1, December 2018
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IPC 6012DA
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IPC-2221 Revision B, November 2012
GENERIC STANDARD ON PRINTED BOARD DESIGN
Includes all amendments and changes through Appendix , June 2018

IPC-2221

Revision B, November 2012

Complete Document
 
GENERIC STANDARD ON PRINTED BOARD DESIGN
Includes all amendments and changes through Appendix , June 2018
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CONTAINS COLOR * VERSION 2.0
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IPC-7711/7721 Revision C, January 2017
Rework, Modification and Repair of Electronic Assemblies

IPC-7711/7721

Revision C, January 2017

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Rework, Modification and Repair of Electronic Assemblies
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IPC-7095 Revision D, June 2018
Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-7095

Revision D, June 2018

Complete Document
 
Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
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CONTAINS COLOR - PDF & HARD COPY
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J-STD-003 Revision C, September 2013
Solderability Tests for Printed Boards
Includes all amendments and changes through Amendment 2, September 2017

J-STD-003

Revision C, September 2013

Complete Document
 
Solderability Tests for Printed Boards
Includes all amendments and changes through Amendment 2, September 2017
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SEE ALSO J-STD-003 CD * CONTAINS COLOR
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IPC-4101 Revision E, March 2017
Specification for Base Materials for Rigid and Multilayer Printed Boards

IPC-4101

Revision E, March 2017

Complete Document
 
Specification for Base Materials for Rigid and Multilayer Printed Boards
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IPC-CC-830 Revision C, December 2018
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC-CC-830

Revision C, December 2018

Complete Document
 
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
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J-STD-033 Revision D, April 2018
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

J-STD-033

Revision D, April 2018

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Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
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SAME AS JEDEC J-STD-033
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IPC-7093 2011 Edition, March 2011
Design and Assembly Process Implementation for Bottom Termination Components

IPC-7093

2011 Edition, March 2011

Complete Document
 
Design and Assembly Process Implementation for Bottom Termination Components
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IPC-SM-840 Revision E, December 2010
Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC-SM-840

Revision E, December 2010

Complete Document
 
Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
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IPC-2223 Revision D, September 2016
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-2223

Revision D, September 2016

Complete Document
 
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
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IPC-4552 Revision A, August 2017
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

IPC-4552

Revision A, August 2017

Complete Document
 
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
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IPC-6013 Revision D, September 2017
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID- FLEXIBLE PRINTED BOARDS
Includes all amendments and changes through Amendment 1, April 2018

IPC-6013

Revision D, September 2017

Complete Document
 
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE/RIGID- FLEXIBLE PRINTED BOARDS
Includes all amendments and changes through Amendment 1, April 2018
Active, Most Current
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PDF ONLY ONCE INVENTORY IS DELEPLTED
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