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IPC-G-400 contains the following items:

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IPC-2141 Revision A, March 2004
DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
Includes all amendments and changes through Errata , 2016

IPC-2141

Revision A, March 2004

Complete Document
 
DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
Includes all amendments and changes through Errata , 2016
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IPC-2221 Revision B, November 2012
GENERIC STANDARD ON PRINTED BOARD DESIGN
Includes all amendments and changes through Appendix , June 2018

IPC-2221

Revision B, November 2012

Complete Document
 
GENERIC STANDARD ON PRINTED BOARD DESIGN
Includes all amendments and changes through Appendix , June 2018
Active, Most Current
Additional Comments:
CONTAINS COLOR * VERSION 2.0
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IPC-A-311 1996 Edition, March 1996
Process Controls for Phototool Generation and Use

IPC-A-311

1996 Edition, March 1996

Complete Document
 
Process Controls for Phototool Generation and Use
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IPC-A-600 Revision J, May 2016
Acceptability of Printed Boards

IPC-A-600

Revision J, May 2016

Complete Document
 
Acceptability of Printed Boards
Active, Most Current
EN
Additional Comments:
SEE ALSO IPC-A-610
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IPC-A-610 Revision G, October 2017
Acceptability of Electronic Assemblies

IPC-A-610

Revision G, October 2017

Complete Document
 
Acceptability of Electronic Assemblies
Active, Most Current
EN
Additional Comments:
CONTAINS COLOR
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IPC-AI-641 1987 Edition, January 1987
User's Guidelines for Automated Solder Joint Inspection Systems

IPC-AI-641

1987 Edition, January 1987

Complete Document
 
User's Guidelines for Automated Solder Joint Inspection Systems
Not Active, See comments below
EN
Additional Comments:
OBSOLETE NO S/S
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IPC-AI-642 1988 Edition, October 1988
User's Guidelines for Automated Inspection of Artwork, Innerlayers and Unpopulated PWBs

IPC-AI-642

1988 Edition, October 1988

Complete Document
 
User's Guidelines for Automated Inspection of Artwork, Innerlayers and Unpopulated PWBs
Not Active, See comments below
EN
Additional Comments:
OBSOLETE NO S/S
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IPC-C-406 1990 Edition, January 1990
Design and Application Guidelines for Surface Mount Connectors

IPC-C-406

1990 Edition, January 1990

Complete Document
 
Design and Application Guidelines for Surface Mount Connectors
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IPC-CC-110 Revision A, December 1997
GUIDELINES FOR SELCTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS

IPC-CC-110

Revision A, December 1997

Complete Document
 
GUIDELINES FOR SELCTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS
Additional Comments:
CNCL S/S BY IPC-4121
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IPC-CH-65 Revision B, July 2011
Guidelines for Cleaning of Printed Boards and Assemblies

IPC-CH-65

Revision B, July 2011

Complete Document
 
Guidelines for Cleaning of Printed Boards and Assemblies
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IPC-CI-408 1994 Edition, January 1994
Solderless Surface Mount Connector Design Characteristics and Application Guidelines

IPC-CI-408

1994 Edition, January 1994

Complete Document
 
Solderless Surface Mount Connector Design Characteristics and Application Guidelines
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IPC-CM-770 Revision E, January 2004
Guidelines for Printed Board Component Mounting

IPC-CM-770

Revision E, January 2004

Complete Document
 
Guidelines for Printed Board Component Mounting
Active, Most Current
EN
Additional Comments:
ELECTRONIC FORMAT ONLY
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IPC-D-279 1996 Edition, July 1996
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

IPC-D-279

1996 Edition, July 1996

Complete Document
 
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
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IPC-D-310 Revision C, June 1991
Guidelines for Phototool Generation and Measurement Techniques

IPC-D-310

Revision C, June 1991

Complete Document
 
Guidelines for Phototool Generation and Measurement Techniques
Active, Most Current
EN
Additional Comments:
PDF ONLY
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IPC-D-316 1995 Edition, June 1995
HIGH FREQUENCY DESIGN GUIDE

IPC-D-316

1995 Edition, June 1995

Complete Document
 
HIGH FREQUENCY DESIGN GUIDE
Additional Comments:
W/D S/S BY IPC-2252
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IPC-D-317 Revision A, January 1995
Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques

IPC-D-317

Revision A, January 1995

Complete Document
 
Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques
Additional Comments:
W/D S/S BY IPC-2251
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IPC-D-322 84th Edition, September 1984
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

IPC-D-322

84th Edition, September 1984

Complete Document
 
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes
Active, Most Current
EN
Additional Comments:
PDF ONLY
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IPC-D-390 Revision A, February 1988
Automated Design Guidelines

IPC-D-390

Revision A, February 1988

Complete Document
 
Automated Design Guidelines
Active, Most Current
EN
Additional Comments:
PDF ONLY
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IPC-D-422 1982 Edition, September 1982
Design Guide for Press Fit Rigid Printed Board Backplanes

IPC-D-422

1982 Edition, September 1982

Complete Document
 
Design Guide for Press Fit Rigid Printed Board Backplanes
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IPC-DR-572 Revision A, March 2007
Drilling Guidelines for Printed Boards

IPC-DR-572

Revision A, March 2007

Complete Document
 
Drilling Guidelines for Printed Boards
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