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IPC-G-403 contains the following items:

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IPC-A-610 Revision G, October 2017
Acceptability of Electronic Assemblies

IPC-A-610

Revision G, October 2017

Complete Document
 
Acceptability of Electronic Assemblies
Active, Most Current
EN
Additional Comments:
CONTAINS COLOR
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IPC-CH-65 Revision B, July 2011
Guidelines for Cleaning of Printed Boards and Assemblies

IPC-CH-65

Revision B, July 2011

Complete Document
 
Guidelines for Cleaning of Printed Boards and Assemblies
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IPC-CM-770 Revision E, January 2004
Guidelines for Printed Board Component Mounting

IPC-CM-770

Revision E, January 2004

Complete Document
 
Guidelines for Printed Board Component Mounting
Active, Most Current
EN
Additional Comments:
ELECTRONIC FORMAT ONLY
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IPC-FA-251 1992 Edition, February 1992
Assembly Guidelines for Single-Sided and Double- Sided Flexible Printed Circuits

IPC-FA-251

1992 Edition, February 1992

Complete Document
 
Assembly Guidelines for Single-Sided and Double- Sided Flexible Printed Circuits
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IPC-MC-790 1992 Edition, August 1992
Guidelines for Multichip Module Technology Utilization

IPC-MC-790

1992 Edition, August 1992

Complete Document
 
Guidelines for Multichip Module Technology Utilization
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IPC-R-700 Revision C, January 1988
Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies

IPC-R-700

Revision C, January 1988

Complete Document
 
Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies
Additional Comments:
W/D S/S BY IPC-7711A/7721A*NOT AVAILABLE*
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IPC-S-816 1993 Edition, July 1993
SMT Process Guideline and Checklist

IPC-S-816

1993 Edition, July 1993

Complete Document
 
SMT Process Guideline and Checklist
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IPC-SM-780 1988 Edition, July 1988
Component Packaging and Interconnecting with Emphasis on Surface Mounting

IPC-SM-780

1988 Edition, July 1988

Base Document
 
Component Packaging and Interconnecting with Emphasis on Surface Mounting
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IPC-SM-784 1990 Edition, November 1990
Guidelines for Chip-on- Board Technology Implementation

IPC-SM-784

1990 Edition, November 1990

Complete Document
 
Guidelines for Chip-on- Board Technology Implementation
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IPC-SM-785 1992 Edition, November 1992
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments

IPC-SM-785

1992 Edition, November 1992

Complete Document
 
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
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IPC-SMC-TR-001 1989 Edition, January 1989
AN INTRODUCTION TO TAPE AUTOMATED BONDING & FINE PITCH TECHNOLOGY

IPC-SMC-TR-001

1989 Edition, January 1989

Complete Document
 
AN INTRODUCTION TO TAPE AUTOMATED BONDING & FINE PITCH TECHNOLOGY
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J-STD-012 1996 Edition, January 1996
Implementation of Flip Chip and Chip Scale Technology
Includes all amendments and changes through Change/Amendment , January 1996

J-STD-012

1996 Edition, January 1996

Complete Document
 
Implementation of Flip Chip and Chip Scale Technology
Includes all amendments and changes through Change/Amendment , January 1996
Additional Comments:
W/D S/S BY IPC-7094
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J-STD-013 1996 Edition, July 1996
Implementation of Ball Grid Array and Other High Density Technology
Includes all amendments and changes through Change/Amendment , July 1996

J-STD-013

1996 Edition, July 1996

Complete Document
 
Implementation of Ball Grid Array and Other High Density Technology
Includes all amendments and changes through Change/Amendment , July 1996
Additional Comments:
INCLUDES PHOTOS W/D S/S BY IPC-7095 C/R
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