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NEMA CB 1 January 1, 2000
Brushes for Electrical Machines
Includes all amendments and changes through Reaffirmation Notice , 2012
NEMA CB 1 January 1, 2000
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Brushes for Electrical Machines
Includes all amendments and changes through Reaffirmation Notice , 2012
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PIP PN09CB1S01 2011 Edition, July 1, 2011
Piping Material Specification 9CB1S01 Class 900, Killed Carbon Steel, Socket Weld, 0.063" C.A. Process
PIP PN09CB1S01 2011 Edition, July 1, 2011
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Piping Material Specification 9CB1S01 Class 900, Killed Carbon Steel, Socket Weld, 0.063" C.A. Process
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PIP PN01CB1S01 2011 Edition, July 1, 2011
Piping Material Specification 1CB1S01 Class 150, Killed Carbon Steel, Socket Weld, 0.063" C.A. Process
PIP PN01CB1S01 2011 Edition, July 1, 2011
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Piping Material Specification 1CB1S01 Class 150, Killed Carbon Steel, Socket Weld, 0.063" C.A. Process
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PIP PN15CB1S01 2011 Edition, July 1, 2011
Piping Material Specification 15CB1S01 Class 1500, Killed Carbon Steel, Socket Weld, 0.063" C.A. Process
PIP PN15CB1S01 2011 Edition, July 1, 2011
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Piping Material Specification 15CB1S01 Class 1500, Killed Carbon Steel, Socket Weld, 0.063" C.A. Process
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PIP PN03CB1S01 2011 Edition, July 1, 2011
Piping Material Specification 3CB1S01 Class 300, Killed Carbon Steel, Socket Weld, 0.063" C.A. Process
PIP PN03CB1S01 2011 Edition, July 1, 2011
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PIP PN06CB1S01 2011 Edition, July 1, 2011
Piping Material Specification 6CB1S01 Class 600, Killed Carbon Steel, Socket Weld, 0.063" C.A. Process
PIP PN06CB1S01 2011 Edition, July 1, 2011
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EIA CB 5-1 1971 Edition, May 1, 1971
Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
EIA CB 5-1 1971 Edition, May 1, 1971
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Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
Additional Comments: STABILIZED: 01/2014 * ADDENDUM TO EIA CB 5
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NEMA CB 2 1987 Edition, January 1, 1987
Characterizing the Physical and Chemical Properties of Electrical Discharge Machining (EDM) Graphite
Includes all amendments and changes through Reaffirmation Notice , 1993
NEMA CB 2 1987 Edition, January 1, 1987
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Characterizing the Physical and Chemical Properties of Electrical Discharge Machining (EDM) Graphite
Includes all amendments and changes through Reaffirmation Notice , 1993
Additional Comments: W/D NO S/S
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NEMA CB 4 1989 Edition, 1989
SEMICONDUCTOR GRAPHITE
NEMA CB 4 1989 Edition, 1989
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SEMICONDUCTOR GRAPHITE
Additional Comments: W/D NO S/S
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NEMA CB 3 1990 Edition, 1990
GUIDELINES FOR PREPARATION OF MATERIAL SAFETY DATA SHEETS FOR CARBON AND GRAPHITES
NEMA CB 3 1990 Edition, 1990
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GUIDELINES FOR PREPARATION OF MATERIAL SAFETY DATA SHEETS FOR CARBON AND GRAPHITES
Additional Comments: W/D NO S/S
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NEMA CB 5 90th Edition, 1995
GUIDELINES FOR PREPARATION OF WARNING LABELS FOR CARBON AND GRAPHITE ELECTRICAL PRODUCTS
Includes all amendments and changes through Reaffirmation Notice , 1995
NEMA CB 5 90th Edition, 1995
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GUIDELINES FOR PREPARATION OF WARNING LABELS FOR CARBON AND GRAPHITE ELECTRICAL PRODUCTS
Includes all amendments and changes through Reaffirmation Notice , 1995
Additional Comments: W/D NO S/S
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BS 2011-2.1CB 1990 Edition, May 31, 1990
Environmental testing - Part 2.1 Tests - Test Cb: Damp heat, steady state, primarily for equipment
BS 2011-2.1CB 1990 Edition, May 31, 1990
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Superseded By: BS EN 60068-2-78
Environmental testing - Part 2.1 Tests - Test Cb: Damp heat, steady state, primarily for equipment
Additional Comments: W/D S/S BY BS EN 60068-2-78
Page Count:10
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EIA CB 11 1986 Edition, January 1, 1986
Surface Mounting of Multilayer Ceramic Chip Capacitors, Guidelines for
EIA CB 11 1986 Edition, January 1, 1986
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Surface Mounting of Multilayer Ceramic Chip Capacitors, Guidelines for
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EIA CB 16 1999 Edition, February 1, 1999
Integrated Passive Device (IPD) Definitions
EIA CB 16 1999 Edition, February 1, 1999
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Integrated Passive Device (IPD) Definitions
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EIA CB 12 1990 Edition, January 1, 1990
Gold Plating Study Test Report
EIA CB 12 1990 Edition, January 1, 1990
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Gold Plating Study Test Report
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EIA CB 14 1993 Edition, January 1, 1993
Contact Lubrication
EIA CB 14 1993 Edition, January 1, 1993
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Contact Lubrication
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EIA CB 3 Revision B, May 1, 1966
Specifications and Standards Associated with Solders and Soldering
EIA CB 3 Revision B, May 1, 1966
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Specifications and Standards Associated with Solders and Soldering
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EIA CB 6 Revision A, October 1, 1987
Guide for the Use of Quartz Crystal Units for Freqency Control
EIA CB 6 Revision A, October 1, 1987
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Guide for the Use of Quartz Crystal Units for Freqency Control
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EIA CB 13 1990 Edition, January 1, 1990
X-Ray Fluorescence for Measuring Plating Thickness
EIA CB 13 1990 Edition, January 1, 1990
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X-Ray Fluorescence for Measuring Plating Thickness
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EIA CB 5 1969 Edition, July 1, 1969
Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
EIA CB 5 1969 Edition, July 1, 1969
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Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
Additional Comments: STABILIZED: MARCH 2014
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