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IPC-4121 January 2000
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications

IPC-4121

January 2000

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Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications
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IPC-4130 1998 Edition, September 1998
Specification and Characterization Methods for Nonwoven "E" Glass Mat

IPC-4130

1998 Edition, September 1998

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Specification and Characterization Methods for Nonwoven "E" Glass Mat
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IPC-4202 Revision B, December 2016
Flexible Base Dielectrics for Use in Flexible Printed Boards

IPC-4202

Revision B, December 2016

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Flexible Base Dielectrics for Use in Flexible Printed Boards
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IPC-4202 CHINESE Revision A, April 2010
Flexible Base Dielectrics for Use in Flexible Printed Circuitry
(Document Language: Chinese)

IPC-4202 CHINESE

Revision A, April 2010

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Flexible Base Dielectrics for Use in Flexible Printed Circuitry
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IPC-4203 Revision B, March 2018
Cover and Bonding Material for Flexible Printed Circuitry

IPC-4203

Revision B, March 2018

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Cover and Bonding Material for Flexible Printed Circuitry
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IPC-4203 CD Revision A, January 2013
Cover and Bonding Material for Flexible Printed Circuitry

IPC-4203 CD

Revision A, January 2013

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Cover and Bonding Material for Flexible Printed Circuitry
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EN
Additional Comments:
STANDALONE VERSION-CONTACT IHS FOR NETWORKING
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IPC-4204 Revision B, August 2018
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

IPC-4204

Revision B, August 2018

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Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
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IPC-4204 CD Revision A, October 2011
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Includes all amendments and changes through Amendment 1, October 2013

IPC-4204 CD

Revision A, October 2011

Complete Document
 
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Includes all amendments and changes through Amendment 1, October 2013
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EN
Additional Comments:
STANDALONE VERSION-CONTACT IHS FOR NETWORKING
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IPC-4204 CHINESE Revision A, October 2011
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
(Document Language: Chinese)

IPC-4204 CHINESE

Revision A, October 2011

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Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
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IPC-4411 Revision A, November 2003
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-4411

Revision A, November 2003

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Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
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IPC-4412 Revision B, May 2013
SPECIFICATION FOR FINISHED FABRIC WOVEN FROM "E" GLASS FOR PRINTED BOARDS
Includes all amendments and changes through Amendment 2, May 2018

IPC-4412

Revision B, May 2013

Complete Document
 
SPECIFICATION FOR FINISHED FABRIC WOVEN FROM "E" GLASS FOR PRINTED BOARDS
Includes all amendments and changes through Amendment 2, May 2018
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IPC-4412 CHINESE Revision B, May 2013
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
(Document Language: Chinese)

IPC-4412 CHINESE

Revision B, May 2013

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Specification for Finished Fabric Woven from "E" Glass for Printed Boards
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IPC-4550 FAM
PLATING SPECIFICATIONS *STANDARDS INCLUDED (4552,4553,4554,4556) *KIT*

IPC-4550 FAM

Complete Document
 
PLATING SPECIFICATIONS *STANDARDS INCLUDED (4552,4553,4554,4556) *KIT*
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Additional Comments:
HARDCOPY ONLY
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IPC-4552 Revision A, August 2017
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

IPC-4552

Revision A, August 2017

Complete Document
 
Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
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EN
Additional Comments:
CONTAINS COLOR
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IPC-4552 CD 2012 Edition, December 2012
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
Includes all amendments and changes through Amendment 2, December 2012

IPC-4552 CD

2012 Edition, December 2012

Complete Document
 
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
Includes all amendments and changes through Amendment 2, December 2012
Active, Most Current
EN
Additional Comments:
OBSOLETE WITH NO REPLACMENT
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IPC-4552 GERMAN 2002 Edition, October 2002
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
(Document Language: German)

IPC-4552 GERMAN

2002 Edition, October 2002

Complete Document
 
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
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DE
Additional Comments:
ELECTRONIC FORMAT
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IPC-4552 GERMAN CD 2002 Edition, October 2002
German Language - SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATINGFOR PRINTED CIRCUIT BOARDS *** CALL FOR QUOTE ***
(Document Language: German)

IPC-4552 GERMAN CD

2002 Edition, October 2002

Complete Document
 
German Language - SPECIFICATION FOR ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) PLATINGFOR PRINTED CIRCUIT BOARDS *** CALL FOR QUOTE ***
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DE
Additional Comments:
STANDALONE VERSION-CONTACT IHS FOR NETWORKING
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IPC-4553 Revision A, May 2009
Specification for Immersion Silver Plating for Printed Boards

IPC-4553

Revision A, May 2009

Complete Document
 
Specification for Immersion Silver Plating for Printed Boards
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EN
Additional Comments:
CONTAINS COLOR
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IPC-4553 CD Revision A, May 2009
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS *** CALL FOR QUOTE ***

IPC-4553 CD

Revision A, May 2009

Complete Document
 
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS *** CALL FOR QUOTE ***
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STANDALONE VERSION-CONTACT IHS FOR NETWORKING
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IPC-4553 CHINESE Revision A, May 2009
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
(Document Language: Chinese)

IPC-4553 CHINESE

Revision A, May 2009

Complete Document
 
SPECIFICATION FOR IMMERSION SILVER PLATING FOR PRINTED BOARDS
Active, Most Current
ZH
Additional Comments:
CONTAINS COLOR
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