Your search resulted in 177 documents for "J-STD J-STD" amongst all current documents.

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  1. MOST RECENT

    2901328

    IPC J-STD-001J▹

    Requirements for Soldered Electrical and Electronic Assemblies

    standard by Association Connecting Electronics Industries, 03/01/2024.

    Languages: English

    Historical Editions: IPC J-STD-001H, IPC J-STD-001G, IPC J-STD-001F-WAM1, IPC J-STD-001F, IPC J-STD-001E, IPC J-STD-001D, IPC J-STD-001C, IPC J-STD-001B

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  2. MOST RECENT

    2031476

    IPC J-STD-002E▹

    Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

    standard by Association Connecting Electronics Industries, 11/01/2017 in Japanese, English, Chinese.

    Languages: Chinese,English,Japanese

    Historical Editions: IPC J-STD-002D, IPC J-STD-002C, IPC J-STD-002B

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  3. MOST RECENT

    1889937

    JEDEC J-STD-048▹

    Notification Standard for Product Discontinuance

    standard by JEDEC Solid State Technology Association, 11/01/2014.

    Languages: English

    Historical Editions: JEDEC JESD48C, JEDEC JESD 48B

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  4. MOST RECENT

    1038585

    IPC J-STD-032▹

    Performance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)

    standard by Association Connecting Electronics Industries, 06/01/2002.

    Languages: English

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  5. MOST RECENT

    17280

    IPC J-STD-012▹

    Implementation of Flip Chip and Chip Scale Technology

    standard by Association Connecting Electronics Industries, 01/01/1996.

    Languages: English

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  6. MOST RECENT

    2045361

    ATIS J-STD-100▹

    Joint ATIS/TIA CMAS Mobile Device Behavior Specification

    standard by The Alliance for Telecommunications Industry Solutions, 01/01/2009.

    Languages: English

    Amendments, rulings, and supplements: ATIS J-STD-100.a

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  7. MOST RECENT

    235646

    IPC J-STD-028▹

    Performance Standard fo Construction of Flip Chip and Chip Scale Bumps

    standard by Association Connecting Electronics Industries, 04/01/1999.

    Languages: English

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  8. MOST RECENT

    1935550

    IPC J-STD-046▹

    Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers

    standard by Association Connecting Electronics Industries, 07/01/2016.

    Languages: English

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  9. MOST RECENT

    17281

    IPC J-STD-013▹

    Implementation of Ball Grid Array and Other High Density Technology

    standard by Association Connecting Electronics Industries, 08/01/1996.

    Languages: English

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  10. MOST RECENT

    2045412

    ATIS J-STD-101▹

    Joint ATIS/TIA CMAS Federal Alert Gateway to CMSD Cateway Interface Specification

    standard by The Alliance for Telecommunications Industry Solutions, 10/01/2009.

    Languages: English

    Amendments, rulings, and supplements: ATIS J-STD-101.b, ATIS J-STD-101.a

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